Zurück zur Startseite
|Eingestellt in Kategorie:

Bild 1 von 2

Zuverlässigkeit, Ausbeute und Stress-Einbrennen: A..., Taeho Kim - Bild 1 von 2
Zuverlässigkeit, Ausbeute und Stress-Einbrennen: A..., Taeho Kim - Bild 2 von 2
Ähnlichen Artikel verkaufen?
Selbst verkaufen

Zuverlässigkeit, Ausbeute und Stress-Einbrennen: A..., Taeho Kim

worldofbooksinc
(233874)
Angemeldet als gewerblicher Verkäufer
Mehr Artikel des Verkäufers
Verkäufer kontaktieren
US $88,99
Ca.CHF 71,31
Artikelzustand:
Sehr gut
Ganz entspannt. Kostenloser Versand & Rückversand.
Versand:
Kostenlos USPS Media MailTM.
Standort: Montgomery Illinois, USA
Lieferung:
Lieferung zwischen Mi, 23. Jul und Fr, 25. Jul nach 94104 bei heutigem Zahlungseingang
Wir wenden ein spezielles Verfahren zur Einschätzung des Liefertermins an – in diese Schätzung fließen Faktoren wie die Entfernung des Käufers zum Artikelstandort, der gewählte Versandservice, die bisher versandten Artikel des Verkäufers und weitere ein. Insbesondere während saisonaler Spitzenzeiten können die Lieferzeiten abweichen.
Rücknahme:
30 Tage Rückgabe. Verkäufer zahlt Rückversand.
Zahlungen:
     Diners Club

Sicher einkaufen

eBay-Käuferschutz
Geld zurück, wenn etwas mit diesem Artikel nicht stimmt. Mehr erfahreneBay-Käuferschutz - wird in neuem Fenster oder Tab geöffnet
Der Verkäufer ist für dieses Angebot verantwortlich.
eBay-Artikelnr.:356678824360
Zuletzt aktualisiert am 03. Jul. 2025 16:46:40 MESZAlle Änderungen ansehenAlle Änderungen ansehen

Artikelmerkmale

Artikelzustand
Sehr gut: Buch, das nicht neu aussieht und gelesen wurde, sich aber in einem hervorragenden Zustand ...
Book Title
Reliability, Yield, and Stress Burn-In: A Unified Approach for...
ISBN
0792381076
EAN
9780792381075
Release Title
Reliability, Yield, and Stress Burn-In: A Unified Approach for...
Artist
Taeho Kim
Brand
N/A
Colour
N/A

Über dieses Produkt

Product Identifiers

Publisher
Springer
ISBN-10
0792381076
ISBN-13
9780792381075
eBay Product ID (ePID)
1068322

Product Key Features

Number of Pages
Xxvi, 394 Pages
Publication Name
Reliability, Yield, and Stress Burn-In : A Unified Approach for Microelectronics Systems Manufacturing and Software Development
Language
English
Publication Year
1998
Subject
Software Development & Engineering / General, Electronics / Semiconductors, Electronics / Circuits / Integrated, Electronics / Microelectronics, Electrical, Manufacturing, Materials Science / Electronic Materials
Type
Textbook
Author
Taeho Kim, Wei-Ting Kary Chien, Way Kuo
Subject Area
Computers, Technology & Engineering
Format
Hardcover

Dimensions

Item Weight
60.3 Oz
Item Length
9.3 in
Item Width
6.1 in

Additional Product Features

Intended Audience
Scholarly & Professional
LCCN
97-039195
Dewey Edition
21
Number of Volumes
1 vol.
Illustrated
Yes
Dewey Decimal
621.381
Table Of Content
1 Overview of Design, Manufacture, and Reliability.- 1.1 Production and Manufacturing Issues.- 1.2 Taguchi Method in Quality Engineering.- 1.3 Manufacturing Design and Reliability.- 1.4 Reliability Standards.- 1.5 Conclusions.- 2 Integrating Reliability into Microelectronics Manufacturing.- 2.1 Microelectronics Manufacturing.- 2.2 New Techniques for Reliability Improvement.- 2.3 Manufacturing Yield and Reliability.- 2.4 Conclusions.- 3 Basic Reliability Concept.- 3.1 Elements of Reliability.- 3.2 Some Useful Life Distributions.- 3.3 Strength and Stress Analysis.- 3.4 Multicomponents Systems.- 3.5 Conclusions.- 4 Yield and Modeling Yield.- 4.1 Definitions and Concept.- 4.2 Yield Models.- 4.3 Yield Prediction.- 4.4 Yield Estimation.- 4.5 Fault Coverage and Occurrence.- 4.6 Yield-reliability Relation Model.- 4.7 Cost Model.- 4.8 Conclusions.- 5 Reliability Stress Tests.- 5.1 Accelerated Life Tests.- 5.2 Environmental Stress Screening (ESS).- 5.3 Failures and Reliability Prediction.- 5.4 Conclusions.- 6 Burn-in Performance, Cost, and Statistical Analysis.- 6.1 Design of Burn-in.- 6.2 Performance and Cost Modeling.- 6.3 Burn-in Optimization.- 6.4 Statistical Approaches for Burn-in Analysis.- 6.5 Conclusions.- 7 Nonparametric Reliability Analysis.- 7.1 The Proportional Hazard Rate Model.- 7.2 The Life Table Estimator (LTE).- 7.3 The Kaplan-Meier Product Limits Estimator.- 7.4 Goodness-of-fit (GOF) Tests.- 7.5 Smoothing Techniques.- 7.6 Conclusions.- 8 Parametric Approaches To Decide Optimal System Burn-in Time.- 8.1 A Time-independent Model.- 8.2 A Time-dependent Model.- 8.3 Conclusions.- 9 Nonparametric Approach and Its Applications to Burn-in.- 9.1 Introduction.- 9.2 Methods.- 9.3 Applications.- 9.4 Conclusions.- 10 Nonparametric Bayesian Approach for Optimal Burn-in.- 10.1The Dirichlet Distribution.- 10.2 The Model Formulation.- 10.3 Other Considerations.- 10.4 Conclusions.- 11 The Dirichlet Process for Reliability Analysis.- 11.1 Method.- 11.2 Variance Reduction in the Dirichlet Process.- 11.3 Determining Optimal Burn-in Time Using the Dirichlet Process.- 11.4 Conclusions.- 12 Software Reliability and Infant Mortality Period of the Bathtub Curve.- 12.1 Basic Concept and Definitions.- 12.2 Stochastic Software Reliability Models.- 12.3 The Non-stochastic Software Reliability Models.- 12.4 A Proposed Procedure of Testing Data.- 12.5 Software Reliability Management.- 12.6 Conclusions.- Epilogue: Cost-effective Design for Stress Burn-in.- References.- Appendices.- A Notation and Nomenclature.- B Failure Modes for Parts.- C Common Probability Distributions.- C.1 Discrete Distributions.- C.2 Continuous Distributions.- D Simulation for U-shaped Hazard Rate Curves.- D.1 Generating U-shaped Hazard Rate Curves.- D.2 Simulation.- E Sample Programs.- E.1 A Sample GINO Program.- E.2 A Sample GAMS program.
Synopsis
The international market is very competitive for high-tech manufacturers to­ day. Achieving competitive quality and reliability for products requires leader­ ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de­ sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur­ ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: * the economic impact of employing the microelectronics fabricated by in­ dustry, * a study of the relationship between reliability and yield, * the progression toward miniaturization and higher reliability, and * the correctness and complexity of new system designs, which include a very significant portion of software., The international market is very competitive for high-tech manufacturers to- day. Achieving competitive quality and reliability for products requires leader- ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de- sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur- ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: - the economic impact of employing the microelectronics fabricated by in- dustry, - a study of the relationship between reliability and yield, - the progression toward miniaturization and higher reliability, and - the correctness and complexity of new system designs, which include a very significant portion of software.
LC Classification Number
TS1-2301

Artikelbeschreibung des Verkäufers

Info zu diesem Verkäufer

worldofbooksinc

97,6% positive Bewertungen•1.2 Mio. Artikel verkauft

Mitglied seit Feb 2020
Antwortet meist innerhalb 24 Stunden
Angemeldet als gewerblicher Verkäufer
In 2002, World of Books Group was founded on an ethos to do good, protect the planet and support charities by enabling more goods to be reused. Since then, we've grown into to a global company ...
Mehr anzeigen
Shop besuchenKontakt

Detaillierte Verkäuferbewertungen

Durchschnitt in den letzten 12 Monaten
Genaue Beschreibung
4.8
Angemessene Versandkosten
5.0
Lieferzeit
5.0
Kommunikation
5.0

Verkäuferbewertungen (269'806)

Alle Bewertungen
Positiv
Neutral
Negativ
Alle Bewertungen ansehen

Noch mehr entdecken: